Sign In | Join Free | My chinapackagenet.com
China SHANGHAI FAMOUS TRADE CO.,LTD logo
SHANGHAI FAMOUS TRADE CO.,LTD
SHANGHAI FAMOUS TRADE CO.,LTD For The Good Reputation,By The Best Quality ,With The Fastest Efficiency.
Verified Supplier

8 Years
Home > Lab Wrapper >

Diamond-copper Composite Material With High Thermal Conductivity COS Series Device Package

Product Categories
SHANGHAI FAMOUS TRADE CO.,LTD
Trust Seal
Verified Supplier
Credit Check
Supplier Assessment
Contact Now

Diamond-copper Composite Material With High Thermal Conductivity COS Series Device Package

  • 1
  • 2
  • 3

Brand Name : ZMSH

Model Number : Diamond-copper composite material

Certification : rohs

Place of Origin : CHINA

Payment Terms : T/T

Delivery Time : 2-4 weeks

Thermal conductivity： : > 450 W /m K

Density : Only 5.6-6.8g/cm3

Surface roughness : Ra < 0.4 μm

Application : Optical communication product packaging

Contact Now

Product Description

Diamond-copper composite material with high thermal conductivity COS series device package

Diamond copper composite material is composed of diamond and copper. It has the characteristics of high thermal conductivity and matching coefficient of thermal expansion with Si. It is very suitable for the packaging field of optoelectronic products with high thermal conductivity requirements, and can replace the currently widely used Cu/W, Al/SiC and other materials.

Diamond-copper Composite Material With High Thermal Conductivity COS Series Device Package

Features

  • High thermal conductivity, thermal conductivity > 450 W/K
  • The thermal expansion number is well matched with Si, GaAs and GaN
  • The density is relatively small, only 5.6-6.8 g/CML 3
  • The surface is smooth and clean, and the surface roughness is < 0.4 μm
  • It can be adjusted according to the customer's needs to adjust the gold and rigid stone content to achieve different properties
  • The surface is easy to be plated with nickel and gold

Diamond-copper Composite Material With High Thermal Conductivity COS Series Device PackageDiamond-copper Composite Material With High Thermal Conductivity COS Series Device Package

Technical Parameters

Brand Diamond content Vol.% Thermal conductivity W/MK Coefficient of thermal expansion 10-6/K Flexural strength MPa
D40Cu60 40 450 7.5 300
D50Cu50 50 500 6.8 250
D60Cu40 60 600 6.0 200

Applications

1. Optical communication product packaging
2. COS tie piece sealing
3. T/R component packaging
4. Other heat sink

Diamond-copper Composite Material With High Thermal Conductivity COS Series Device PackageDiamond-copper Composite Material With High Thermal Conductivity COS Series Device Package

Our services

1. Factory direct manufacture and sell.

2. Fast, accurate quotes.

3. Reply to you within 24 working hours.

4. ODM: Customized design is avaliable.

5. Speed and precious delivery.

FAQ

1. Q: How to pay?
A:100％T/T, Paypal, West Union, MoneyGram, Secure payment and Trade
Assurance on and etc..

2. Q: What's the delivery time?
A: (1) For the standard products
For inventory: the delivery is 5 workdays after you place the order.
For customized products: the delivery is 2 or 3 weeks after you place the order.
(2) For the special-shaped products, the delivery is 4 workweeks after you place the order.

3. Q: Can I customize the products based on my need?
A: Yes, we can customize the material, specifications for your optical components
based on your needs.


Product Tags:

Diamond-copper Composite Material

      

0.4μm Diamond-copper Composite Material

      
China Diamond-copper Composite Material With High Thermal Conductivity COS Series Device Package wholesale

Diamond-copper Composite Material With High Thermal Conductivity COS Series Device Package Images

Inquiry Cart 0
Send your message to this supplier
 
*From:
*To: SHANGHAI FAMOUS TRADE CO.,LTD
*Subject:
*Message:
Characters Remaining: (0/3000)
 
You May Like